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職位描述：
工作職責(zé):
1.be responsible for customer audit and customer claim handling;
2.carry on subcon audit include quality management system audit and process audit/package audit;
3.subcon quality performance monitoring and report including cpk, spc, yield, ocap open/closure ratio, excursion open/closure ratio, non-conformance open/closure ratio and claim etc…;
4.driving subcon cip (continual improvement project) to improve yield, quality and reliability performance;
5.responsible for subcon kpi (key performance indicator) and driving the improvement;
6.review supplier 8d report and buyoff;
7.responsible for subcon quality management system(quality standard/spc/fmea/control plan);
8.lesson learn summary and sharing;
9.manage assembly& testing product& process change request in subcon;
10.manage mrb/drb to dispose non-conforming materials in subcon and drive excursion closure through 8d process;
11.manage wafer incoming quality and escalation issue
12.involving into subcon selection;
任職資格:
1. bachelor degree or above. major in engineering or equivalent;
2. typically 3+ years’ working experience in semiconductor assembly and/or test line;
3. excellent knowledge of quality tools (spc, fmea, cp, doe etc.);
4. understanding of iso 9001 or iatf16949;
5.excellent communication and trouble shooting skills;
6.must be proficient in reading and writing in chinese and english